advanced packaging & test (P&T7) Archives - LT Tech Blog

AI in Business Chips for AI (NVIDIA/AMD/TPU)

SK Hynix unveils $13B advanced packaging plant to expand HBM capacity

TL;DR SK Hynix announced a 19 trillion won (~$13 billion) advanced packaging and test facility, P&T7, in Cheongju, South Korea…

January 13, 2026

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