DRAM stacking and testing Archives - LT Tech Blog

AI in Business Chips for AI (NVIDIA/AMD/TPU)

SK Hynix unveils $13B advanced packaging plant to expand HBM capacity

TL;DR SK Hynix announced a 19 trillion won (~$13 billion) advanced packaging and test facility, P&T7, in Cheongju, South Korea…

January 13, 2026

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Cloud & Dev How it works

40-Line Fix Cuts Java Thread User-Time Call Latency by Up to 400×

January 13, 2026

GenAI (models, assistants) Google / Alphabet

Google Translate testing alternate translation options to boost accuracy

January 13, 2026

AI & Machine Learning GenAI (models, assistants)

Reality Check: Generative AI Falling Short on Trust, Value and Scaling

January 13, 2026

AI & Machine Learning Threats & Incidents

ListenBrainz restricts APIs after AI scrapers overload MusicBrainz services

January 13, 2026